SunBond can now provide UV Curing, UV and/or Thermal Curing, Thermal Curing adhesive, for semiconductor packaging, photon assembly, display , electron parts assembly and many other demanding applications, Furthermore, SunBond also offers room temperature, thermal Silver and visible light cure adhesive systems.

These materials can be Electrically & Thermally conductive systems, Surface mount, glob tops, and Chip Underfill materials. With custom formulating services, SunBond can provide solutions to all of your adhesive applications

SunBond has a custom design for resin specific needs. Our group works closely with our customers to develop new products quickly. If you want to fine tune our new product, or if you are in the design phase of the new product, please contact us.